Etchant solutions and developers respectively contain surface active agents for reducing the surface tension in order to ensure a complete wetting of the wafer's surface. A reduction of the surface tension is required for an even wetting of all wafer structures.
Especially the time dependent wetting behaviour is essential for receiving a high homogeneity.
Common measuring methods such as plate or ring method are not suitable for this purpose because those methods only allow measuring the static surface tension and not the needed dynamic surface tension. Furthermore, measuring devices used for static measuring methods have to be cleaned in a very complex way after every measurement.
SITA Tensiometers are based on the bubble pressure method and allow measuring the surface tension from a highly dynamic up to a quasistatic surface tension range. Thus, significant measuring results regarding the wetting ability of solutions and their time dependent behaviour can be received.
Benefit from our many years of experience and optimize your process together with our experts. Please contact us!