After wafers are sawed or cut, their surfaces are contaminated with particles and cutting additives, such as the so-called slurry. For this reason, it is necessary to clean the wafers before further treatments can be processed. Stable conditions of the cleaning agent components are necessary to achieve a high cleanliness level.
The cleaning agent components consume themselves at different rates through a different binding of contamination and carry-over during the cleaning process. Continual monitoring and application-specific dosing of cleaning agent components are needed to achieve high process reliability and part cleanliness.
We offer customized solutions adapted to your cleaning process for continual monitoring and automatic, application-specific dosing of cleaning agent components.
The picture shows the relationship between the cleanliness of wafer surfaces and the surfactant concentration, which can be easily determined and dosed-up by measuring the surface tension.